The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Mar. 04, 2022
Applicant:
Ming Chi University of Technology, New Taipei, TW;
Inventors:
Kun-Cheng Peng, New Taipei, TW;
Wei-Chuan Shih, New Taipei, TW;
Cheng-Rong He, New Taipei, TW;
Ting-Han Chen, New Taipei, TW;
Dong-Qing Su, New Taipei, TW;
Jian-Rong Chen, New Taipei, TW;
Assignee:
Ming Chi University of Technology, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/02 (2006.01); C25D 3/04 (2006.01); C25D 3/10 (2006.01); C25D 3/12 (2006.01); C25D 3/22 (2006.01); C25D 3/32 (2006.01); C25D 3/38 (2006.01); C25D 3/54 (2006.01); C25D 17/00 (2006.01); C12N 1/20 (2006.01);
U.S. Cl.
CPC ...
C25D 3/10 (2013.01); C12N 1/20 (2013.01); C25D 3/12 (2013.01); C25D 3/22 (2013.01); C25D 3/32 (2013.01); C25D 3/38 (2013.01); C25D 17/00 (2013.01);
Abstract
The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; and performing an electroplating process to electroplate metal of the metal chloride onto the workpiece.