The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Jul. 29, 2020
Applicant:
Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, CN;
Inventors:
Rongtao Wang, Kunshan, CN;
Ningning Jia, Kunshan, CN;
Zhenfang Shang, Kunshan, CN;
Weimiao Yu, Kunshan, CN;
Assignee:
ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD., Kunshan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/28 (2006.01); B32B 27/38 (2006.01); C08L 79/08 (2006.01); C08J 5/24 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08J 5/18 (2013.01); C08J 5/244 (2021.05); C08J 5/246 (2021.05); C08J 2379/08 (2013.01); C08J 2463/00 (2013.01); C08J 2479/00 (2013.01); C08J 2483/04 (2013.01); C08L 2205/03 (2013.01);
Abstract
A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations.