The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Dec. 19, 2019
Applicant:
Skc Solmics Co., Ltd., Gyeonggi-do, KR;
Inventors:
Eun Sun Joeng, Ulsan, KR;
Hye Young Heo, Gyeonggi-do, KR;
Jang Won Seo, Busan, KR;
Jong Wook Yun, Gyeonggi-do, KR;
Assignee:
SKC solmics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/10 (2006.01); C08G 18/76 (2006.01); B29C 45/00 (2006.01); B24B 37/26 (2012.01); B24B 37/24 (2012.01); H01L 21/321 (2006.01); B29K 75/00 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C08G 18/10 (2013.01); B24B 37/24 (2013.01); B24B 37/26 (2013.01); B29C 45/0001 (2013.01); C08G 18/7621 (2013.01); B29K 2075/00 (2013.01); C08K 5/0025 (2013.01); H01L 21/3212 (2013.01);
Abstract
In the composition according to the embodiment, the content of an unreacted diisocyanate monomer in a urethane-based prepolymer may be controlled to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.