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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11548829 B1

PDFFull Text
Date of Patent:
Jan. 10, 2023

Filed:

Jan. 20, 2021

Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Asumi Nagai, Okazaki, JP;

Noboru Nishimura, Nagoya, JP;

Hirofumi Yamaguchi, Komaki, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Karl E Group

Int. Cl.
CPC ...
C04B 35/58 (2006.01); C04B 35/575 (2006.01); C04B 35/56 (2006.01); H01L 21/683 (2006.01); C04B 35/645 (2006.01); C04B 37/00 (2006.01);
U.S. Cl.
CPC ...
C04B 35/58092 (2013.01); C04B 35/575 (2013.01); C04B 35/645 (2013.01); C04B 37/00 (2013.01); H01L 21/6833 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/3843 (2013.01); C04B 2235/3891 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/66 (2013.01); C04B 2235/9607 (2013.01);
Abstract

According to the present invention, a dense composite material includes titanium silicide in an amount of 43 to 63 mass %; silicon carbide in an amount less than the mass percentage of the titanium silicide; and titanium carbide in an amount less than the mass percentage of the titanium silicide. In the dense composite material, a maximum value of interparticle distances of the silicon carbide is 40 μm or less, a standard deviation of the interparticle distances is 10 or less, and an open porosity of the dense composite material is 1% or less.

Find Patent Forward Citations

Nagai, Asumi. (2023). Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device (U.S. Patent No. 11548829). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11548829

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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