The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Jun. 28, 2018
Applicant:
Oulun Yliopisto, Oulu, FI;
Inventors:
Assignee:
OULUN YLIOPISTO, Oulu, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/495 (2006.01); H05K 3/28 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
C04B 35/495 (2013.01); H05K 1/185 (2013.01); H05K 3/284 (2013.01); C04B 2235/3203 (2013.01); C04B 2235/3256 (2013.01); C04B 2235/604 (2013.01); C04B 2235/606 (2013.01); C04B 2235/6026 (2013.01); C04B 2235/9607 (2013.01); H05K 2201/062 (2013.01); H05K 2203/1316 (2013.01);
Abstract
A heat resistant electronic component is disclosed, comprising an electronic component covered by a layer of ceramic thermal insulation material containing lithium molybdate LiMoO. A process for manufacturing the heat resistant electronic component comprises obtaining ceramic thermal insulation material containing lithium molybdate LiMoOin a mouldable form, optionally mixing the ceramic thermal insulation material with at least one additive, covering an electronic component with the material, shaping the material covering the electronic component into a desired form, and drying the desired form at a temperature of from 20° C. to 120° C.