The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Nov. 16, 2018
Applicant:
Sciosense B.v., AE Eindhoven, NL;
Inventors:
Casper Van Der Avoort, Waalre, NL;
Willem Frederik Adrianus Besling, Eindhoven, NL;
Remco Henricus Wilhelmus Pijnenburg, Hoogeloon, NL;
Olaf Wunnicke, Eindhoven, NL;
Coen Tak, Waalre, NL;
Assignee:
SCIOSENSE B.V., AE Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81B 7/02 (2006.01); G01L 9/00 (2006.01); H04R 1/04 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81B 7/0074 (2013.01); B81B 7/02 (2013.01); G01L 9/0073 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); B81B 2207/015 (2013.01); H04R 1/04 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01);
Abstract
A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.