The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Dec. 16, 2020
Applicant:

Sii Printer Inc., Chiba, JP;

Inventors:

Suguru Munakata, Chiba, JP;

Daichi Nishikawa, Chiba, JP;

Yuzuru Kubota, Chiba, JP;

Yuki Yamamura, Chiba, JP;

Yuji Nakamura, Chiba, JP;

Assignee:

SII PRINTEK INC., Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1634 (2013.01); B41J 2202/22 (2013.01);
Abstract

Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction. Further, the irradiation operation with the laser is performed a plurality of times for each of the laser processing lines, and the irradiation operations with the laser performed along the same laser processing line of the plurality of laser processing lines are performed at a time interval from when ending a previous irradiation operation with the laser to when starting a subsequent irradiation operation with the laser.


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