The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Sep. 30, 2019
Applicant:

Toyobo Co., Ltd., Osaka, JP;

Inventors:

Hiroko Maruyama, Tsuruga, JP;

Masayuki Haruta, Tsuruga, JP;

Shintaro Ishimaru, Tsuruga, JP;

Assignee:

TOYOBO CO., LTD., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/36 (2006.01); B65D 30/08 (2006.01); B65D 65/40 (2006.01);
U.S. Cl.
CPC ...
B32B 27/36 (2013.01); B65D 31/02 (2013.01); B65D 65/40 (2013.01); B32B 2307/31 (2013.01); B32B 2307/538 (2013.01); B32B 2307/72 (2013.01); B32B 2439/46 (2013.01);
Abstract

The invention provides a sealant film that is less likely to adsorb components formed of various types of organic compounds, has excellent heat sealing characteristics at 140° C., while having low heat sealing strength at 100° C. and being less likely for heat sealing layers to adhere to each other even when the film is used as a packaging bag and the content thereof is warmed in boiling water. The sealant film has at least one heat sealing layer consisting of a polyester component, wherein a heat sealing strength of the heat sealing layer being heat sealed to another heat sealing layer at 100° C. and 0.2 MPa for 2 seconds is 0-5 N/15 mm and at 140° C. and 0.2 MPa for 2 seconds is 8-30 N/15 mm, and a film density including all layers is 1.20 or more and less than 1.39.


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