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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11548239 B1

PDFFull Text
Date of Patent:
Jan. 10, 2023

Filed:

Sep. 22, 2020

Bonding process and system

Applicant:

Textron Innovations, Inc., Providence, RI (US);

Inventors:

Phillip Anthony Kendrick, Wichita, KS (US);

Lawrence Arthur Gintert, Andover, KS (US);

Herbert Lee Skidmore, Viola, KS (US);

Mike Preston McKown, Wichita, KS (US);

Assignee:

Textron Innovations, Inc., Providence, RI (US);

Attorney:

Avek IP, LLC

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Brian R Slawski

Int. Cl.
CPC ...
B29C 70/30 (2006.01); B33Y 80/00 (2015.01); B29C 37/00 (2006.01); B33Y 10/00 (2015.01); B29C 65/48 (2006.01); B29C 65/00 (2006.01); B29C 35/02 (2006.01); B32B 7/08 (2019.01); B32B 37/12 (2006.01); B32B 3/30 (2006.01); B32B 7/05 (2019.01); B32B 7/14 (2006.01); B29K 101/12 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 70/302 (2021.05); B29C 37/0082 (2013.01); B29C 65/48 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); B29C 35/02 (2013.01); B29C 66/1122 (2013.01); B29C 66/21 (2013.01); B29C 66/30325 (2013.01); B29C 66/322 (2013.01); B29C 66/71 (2013.01); B29C 66/729 (2013.01); B29C 66/7212 (2013.01); B29C 66/72141 (2013.01); B29C 66/72523 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29C 66/73921 (2013.01); B29K 2101/12 (2013.01); B29L 2031/3076 (2013.01); B32B 3/30 (2013.01); B32B 7/05 (2019.01); B32B 7/08 (2013.01); B32B 7/14 (2013.01); B32B 37/1292 (2013.01); B32B 2037/1215 (2013.01); B32B 2037/1253 (2013.01);
Abstract

A system and process for bonding involves a pocket made into one article is used to secure that article to another using a flowable, curable material (e.g., resin) which during saturation enters through a passageway and at least partially fills the void. When the article is cured, the article is bonded to another article to which resin has also been applied since the void (now containing cured material) is larger than the passageway.

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Quick Actions:

Kendrick, Phillip. (2023). Bonding process and system (U.S. Patent No. 11548239). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11548239

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