The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Sep. 29, 2020
Applicant:

Sodick Co., Ltd., Kanagawa, JP;

Inventor:

Koichi Yokoyama, Kanagawa, JP;

Assignee:

SODICK CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/54 (2006.01); B29C 45/00 (2006.01); B29C 45/58 (2006.01); B29C 45/60 (2006.01); B29C 45/46 (2006.01); B29C 45/53 (2006.01); B29C 45/77 (2006.01); B29C 45/62 (2006.01); B29K 19/00 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
B29C 45/54 (2013.01); B29C 45/0001 (2013.01); B29C 45/461 (2013.01); B29C 45/531 (2013.01); B29C 45/586 (2013.01); B29C 45/60 (2013.01); B29C 45/62 (2013.01); B29C 45/77 (2013.01); B29K 2019/00 (2013.01); B29K 2101/12 (2013.01);
Abstract

An injection apparatus of the invention injects a molding material supplied from a material supply port, and includes a die, a material supply apparatus that extrudes the molding material that is thread-like or strip-like via the die, and a material guide apparatus that guides the molding material supplied via the die to the material supply port. The material discharge port of the material supply apparatus and the die protrude downward in the material supply apparatus, and a pressure inside the material guide apparatus is reduced by a pressure reducing apparatus from a pressure reducing port provided above the material discharge port of the material supply apparatus and the die.


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