The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

May. 05, 2020
Applicant:

Sumitomo Riko Company Limited, Aichi, JP;

Inventors:

Katsumi Okashita, Aichi, JP;

Shota Hayashi, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B29C 45/14 (2006.01); B81C 99/00 (2010.01); B29K 83/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14336 (2013.01); B01L 3/502707 (2013.01); B81C 99/0085 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/123 (2013.01); B01L 2300/161 (2013.01); B29K 2083/005 (2013.01); B29L 2031/756 (2013.01);
Abstract

A fluid device composite member includes: a silicone member that includes a body part which is made of silicone and which has a flow-path-defining section for defining a flow path on one surface of the body part, and that includes barrier layer having hydrophilicity or hydrophobicity disposed in at least a portion of the flow-path-defining section; and a resin substrate disposed on another surface of the body part opposite to the one surface. This method for manufacturing the fluid device composite member includes a layered body manufacturing step in which a liquid silicone material is placed on a surface of the resin substrate, and the liquid silicone material is cured at a temperature of 100° C. or less to obtain a layered body in which a silicone cured product is bonded to the resin substrate.


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