The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Nov. 06, 2020
Applicant:

Purdue Research Foundation, West Lafayette, IN (US);

Inventors:

Tatsuya Sugihara, Osaka, JP;

Srinivasan Chandrasekar, West Lafayette, IN (US);

Anirudh Udupa, West Lafayette, IN (US);

Koushik Viswanathan, Bangalore, IN;

Kevin Paul Trumble, West Lafayette, IN (US);

James Bradley Mann, Pensacola, FL (US);

Assignee:

Purdue Research Foundation, West Lafayette, IN (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 8/02 (2006.01); B23P 25/00 (2006.01); B05D 1/18 (2006.01); C23C 8/40 (2006.01);
U.S. Cl.
CPC ...
B23P 25/003 (2013.01); B05D 1/185 (2013.01); B05D 2202/25 (2013.01); C23C 8/02 (2013.01); C23C 8/40 (2013.01);
Abstract

Methods of inducing segmented flow in a material in which a ductile flow mode would otherwise occur during machining. A monolayer molecular film is formed on a surface of a body of a material in a state such that the material exhibits ductile flow when subjected to shear. The monolayer molecular film has molecules each having a head group adsorbed to the surface, a terminal group, and a hydrocarbon chain therebetween having a chain length of greater than 6. A surface portion of the body is removed by engaging the body with a tool in a contact region below the surface of the body and moving the tool relative to the body to remove the surface portion and the monolayer molecular film thereon. The monolayer molecular film induces segmented flow in the material during the removing of the surface portion.


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