The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Dec. 03, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Koji Funaoka, Tokyo, JP;

Masayuki Saiki, Tokyo, JP;

Takashi Inoue, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/382 (2014.01); B23K 26/0622 (2014.01); B23K 26/14 (2014.01); B23K 26/073 (2006.01); B23K 26/402 (2014.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 26/382 (2015.10); B23K 26/0622 (2015.10); B23K 26/073 (2013.01); B23K 26/1462 (2015.10); B23K 26/402 (2013.01); B23K 2103/172 (2018.08);
Abstract

A laser processing method for laser processing of a workpiece made of a base material and a fiber reinforced composite material containing fibers having a thermal conductivity and a processing threshold higher than physical properties of glass fibers. The laser processing method includes a step of processing the workpiece by forming a plurality of through-holes extending through the workpiece by irradiating the workpiece with pulsed laser light from a processing head while relatively moving the workpiece and the processing head in a predetermined cutting direction. The pulsed laser light has a pulse width smaller than 1 ms and an energy density capable of forming each of the through-holes by a single pulse.


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