Machining device, machining unit, and machining method

Abstract

Provided are a machining device (), a machining unit, and a machining method that irradiate a workpiece () with a laser beam to perform cutting or boring machining of the workpiece (). The invention has a laser output device (), a guiding optical system () that guides a laser beam, and an irradiating head () that guides a laser beam and irradiates the workpiece () with the laser beam. The irradiating head () integrally rotates a first prism () and a second prism () with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece () while rotating the position of irradiation to the workpiece. A control device () calculates an allowable rotational frequency range of the laser beam on the basis of the relationship between an allowable thickness of a remelted layer of the workpiece () and a rotational frequency, or the relationship between an allowable thickness of an oxidization layer of the workpiece and the rotational frequency, determines a rotational frequency included in the allowable rotational frequency range as the rotational frequency of the rotation mechanism, and rotates the rotation mechanism at the determined rotational frequency, thereby enabling high-precision machining to be performed with a simple configuration.