The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Mar. 22, 2021
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Koichi Ozaki, Okayama, JP;
Tadao Fukuta, Kurashiki, JP;
Yasutoshi Hideshima, Nagano, JP;
Hidefumi Nakamura, Aomori, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2022.01); B22F 3/22 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0003 (2013.01); B22F 3/225 (2013.01); B22F 2301/056 (2013.01); B22F 2301/058 (2013.01);
Abstract
An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cmor more.