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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11547005 B1

PDFFull Text
Date of Patent:
Jan. 03, 2023

Filed:

Sep. 07, 2018

Etching for bonding polymer material to anodized metal

Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

James A. Curran, Morgan Hill, CA (US);

Todd S. Mintz, San Jose, CA (US);

Isabel Yang, San Jose, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:

Dorsey & Whitney LLP

Primary Examiner:

Catherine A Simone

Int. Cl.
CPC ...
H05K 5/02 (2006.01); C25F 3/14 (2006.01); H04M 1/02 (2006.01); H05K 5/04 (2006.01); H05K 5/06 (2006.01); C23F 1/20 (2006.01); B29C 45/14 (2006.01); C25D 11/10 (2006.01); C25D 11/08 (2006.01); H05K 5/00 (2006.01); C23G 1/12 (2006.01); B29K 705/00 (2006.01); C23F 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0217 (2013.01); B29C 45/14311 (2013.01); C25D 11/08 (2013.01); C25D 11/10 (2013.01); C25F 3/14 (2013.01); H04M 1/0283 (2013.01); H05K 5/0004 (2013.01); H05K 5/0086 (2013.01); H05K 5/04 (2013.01); H05K 5/063 (2013.01); B29K 2705/00 (2013.01); C23F 1/02 (2013.01); C23F 1/20 (2013.01); C23G 1/125 (2013.01); Y10T 428/24521 (2015.01); Y10T 428/24545 (2015.01);
Abstract

This application relates to a multi-piece enclosure for a portable electronic device. The enclosure includes a metal part including a metal substrate and a metal oxide layer overlaying the metal substrate, the metal oxide layer having an external surface that includes openings that lead into undercut regions. The openings are characterized as having a first width, and the undercut regions are characterized as having a second width that is greater than the first width. The enclosure further includes a non-metallic bulk layer including protruding portions that extend into the undercut regions such that the non-metallic bulk layer is interlocked with the metal part.

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