The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Jan. 07, 2020
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventor:
Bradley Paul Barber, Acton, MA (US);
Assignee:
SKYWORKS SOLUTIONS, INC., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); C23C 28/02 (2006.01); B32B 15/01 (2006.01); H01L 21/321 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 23/10 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H05K 3/10 (2013.01); B32B 15/01 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); H01L 21/321 (2013.01); H01L 21/50 (2013.01); H01L 23/10 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01); H05K 3/3463 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/16168 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27416 (2013.01); H01L 2224/27418 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29316 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29409 (2013.01); H01L 2224/29411 (2013.01); H01L 2224/29424 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83805 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/165 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10984 (2013.01);
Abstract
A bonding structure includes a first layer of first alloy component disposed on a substrate and a first layer of a second alloy component disposed on the first alloy component. The second alloy component has a lower melting temperature than the first alloy component. A second layer of the first alloy component is disposed on the first layer of the second alloy component and a second layer of the second alloy component is disposed on the second layer of the first alloy component.