The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Jul. 16, 2021
Applicant:

National Taipei University of Technology, Taipei, TW;

Inventors:

Syang-Peng Rwei, Taipei, TW;

Tzu-Wei Chou, Taipei, TW;

Sheng-Yuan Huang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H05K 1/118 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H05K 2201/049 (2013.01); H05K 2201/09281 (2013.01); H05K 2201/09754 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10522 (2013.01);
Abstract

A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards.


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