The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Nov. 05, 2021
Applicant:
The Boeing Company, Chicago, IL (US);
Inventor:
John E. Rogers, Huntsville, AL (US);
Assignee:
THE BOEING COMPANY, Chicago, IL (US);
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); B29C 64/141 (2017.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); B29C 64/141 (2017.08); H05K 1/0237 (2013.01); H05K 1/148 (2013.01); H05K 3/108 (2013.01); H05K 3/361 (2013.01);
Abstract
A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.