Fabric interconnection for memory banks based on network-on-chip methodology

Abstract

Embodiments disclosed herein generally relate to the use of Network-on-Chip architecture for solid state memory structures which provide for the access of memory storage blocks via a router. As such, data may be sent to and/or from the memory storage blocks as data packets on the chip. The Network-on-Chip architecture may further be utilized to interconnect unlimited numbers of memory cell matrices, spread on a die, thus allowing for reduced latencies among matrices, selective power control, unlimited memory density growth without major latency penalties, and reduced parasitic capacitance and resistance. Other benefits may include improved signal integrity, larger die areas available to implement memory arrays, and higher frequency of operation.