The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Jan. 15, 2020
Applicant:
Skyworks Filter Solutions Japan Co., Ltd., Kadoma, JP;
Inventors:
Atsushi Takano, Kadoma, JP;
Mitsuhiro Furukawa, Nishinomiya, JP;
Ichiro Kameyama, Katano, JP;
Tetsuya Uebayashi, Ibaraki, JP;
Assignee:
SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD., Kadoma, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/007 (2006.01); B81B 1/00 (2006.01); B81C 1/00 (2006.01); H03H 9/17 (2006.01); H03H 9/19 (2006.01); H03H 9/54 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 3/0072 (2013.01); B81B 1/002 (2013.01); B81C 1/00087 (2013.01); H03H 9/171 (2013.01); H03H 9/19 (2013.01); B81B 2201/0271 (2013.01); B81B 2203/0353 (2013.01); B81B 2207/09 (2013.01); B81C 2201/013 (2013.01); H03H 9/54 (2013.01); H03H 9/64 (2013.01);
Abstract
An electronic component comprises a substrate including a main surface on which a functional unit is formed and a cap layer defining a cavity enclosing and covering the functional unit. The cap layer is provided with holes communicating an inside of the cavity with an outside of the cavity. A resin layer covers the cap layer and the main surface and includes one or more bores and a solder layer having a thickness less than a thickness of the resin layer disposed within the one or more bores.