The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Jun. 18, 2019
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Maiko Ariga, Tokyo, JP;

Yusuke Inaba, Tokyo, JP;

Kazuki Yamaoka, Tokyo, JP;

Toshio Sugaya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/50 (2006.01); H01S 5/10 (2021.01); H01S 5/40 (2006.01); G02B 6/42 (2006.01); H01S 5/022 (2021.01); H01S 5/02326 (2021.01); H01S 5/00 (2006.01);
U.S. Cl.
CPC ...
H01S 5/50 (2013.01); G02B 6/42 (2013.01); H01S 5/022 (2013.01); H01S 5/02326 (2021.01); H01S 5/101 (2013.01); H01S 5/40 (2013.01); H01S 5/005 (2013.01);
Abstract

A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.


Find Patent Forward Citations

Ariga, Maiko. (2023). Semiconductor laser module and method of manufacturing semiconductor laser module (U.S. Patent No. 11545814). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11545814

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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