The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Jun. 26, 2020
Applicant:
Aptiv Technologies Limited, St. Michael, BB;
Inventors:
Olivier Malandain, Ormes, FR;
Stéphane Barlerin, Fatines, FR;
Assignee:
APTIV TECHNOLOGIES LIMITED, St. Michael, BB;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/66 (2006.01); G01K 13/00 (2021.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); B60L 53/16 (2019.01);
U.S. Cl.
CPC ...
H01R 13/665 (2013.01); G01K 13/00 (2013.01); H05K 1/0201 (2013.01); H05K 1/0206 (2013.01); H05K 1/0207 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/182 (2013.01); B60L 53/16 (2019.02); H01R 2201/26 (2013.01); H05K 2201/10151 (2013.01);
Abstract
A printed circuit board is housed in a connector. A temperature sensor is mounted on the printed circuit board between two connection pads located on one of the faces of the printed circuit board. A contact housed in the connector is placed in thermal continuity with two thermal conduction lands, one of which is arranged on the same face of the printed circuit board as the connection pads and the other of which is arranged beneath the temperature sensor. Each of the connection pads is connected to a temperature measurement circuit.