The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Dec. 31, 2020
Applicant:

Samsung Sdi Co., Ltd., Yongin-si, KR;

Inventors:

Heejung Ko, Yongin-si, KR;

Kijung Kim, Yongin-si, KR;

Yongjin Park, Yongin-si, KR;

Byongchul Woo, Yongin-si, KR;

Jong-Ha Lee, Yongin-si, KR;

Assignee:

Samsung SDI Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 50/193 (2021.01); H01M 50/181 (2021.01); H01M 50/109 (2021.01); H01M 50/148 (2021.01); H01M 10/04 (2006.01);
U.S. Cl.
CPC ...
H01M 50/193 (2021.01); H01M 10/0427 (2013.01); H01M 50/109 (2021.01); H01M 50/154 (2021.01); H01M 50/181 (2021.01);
Abstract

A rechargeable battery includes: an electrode assembly including a first electrode, a second electrode, and a separator between the first electrode and the second electrode; a case configured to be connected to the first electrode and accommodate the electrode assembly, and including an opening to expose the electrode assembly; a cap plate configured to be coupled to the case to cover an outer area of the opening, and including a through-hole to expose a central area of the opening; a terminal plate configured to cover the through-hole and to be connected to the second electrode; and a thermal-fusion layer configured to be arranged between the cap plate and the terminal plate and to insulation-bond the cap plate and the terminal plate, and the thermal-fusion layer includes a plurality of layers including a thermoplastic resin layer.


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