The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Mar. 26, 2020
Applicant:
Shenzhen Goodix Technology Co., Ltd., Shenzhen, CN;
Inventor:
Haoxiang Dong, Shenzhen, CN;
Assignee:
SHENZHEN GOODIX TECHNOLOGY CO., LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); G06V 40/13 (2022.01);
U.S. Cl.
CPC ...
H01L 27/14678 (2013.01); G06V 40/1318 (2022.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 27/14618 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 24/49 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49176 (2013.01); H01L 2224/73265 (2013.01);
Abstract
The present application provides a chip package structure and an electronic device, which could reduce a chip package thickness and implement ultra-thinning of chip package. The chip package structure includes a chip, a substrate, a lead and a lead protection adhesive; the lead is configured to electrically connect the chip and the substrate; the lead protection adhesive is configured to support the lead, where a highest point of the lead protection adhesive is not higher than a highest point of an upper edge of the lead.