The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Mar. 19, 2021
Applicant:

Stanley Electric Co., Ltd., Tokyo, JP;

Inventors:

Kyotaro Koike, Tokyo, JP;

Ji-Hao Liang, Tokyo, JP;

Mitsunori Harada, Tokyo, JP;

Shunya Ide, Tokyo, JP;

Hiroshi Kotani, Tokyo, JP;

Soji Owada, Tokyo, JP;

Satoshi Ando, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01);
Abstract

A light-emitting device according to the present invention comprises: a mounting board; a plurality of light-emitting elements that each include a supporting substrate and a semiconductor structure layer, the supporting substrate being disposed on the mounting board, and the semiconductor structure layer being formed on the supporting substrate and including a light-emitting layer, a wavelength conversion member that covers the plurality of light-emitting elements above the light-emitting elements and converts a wavelength of a light emitted from the light-emitting layer; a translucent member that covers a lower surface of the wavelength conversion member and covers the semiconductor structure layer on the supporting substrate; and a resin member filled between the plurality of light-emitting elements, the resin member being formed of a resin material containing particles having a light reflectivity. The translucent member includes a thin film portion having a constant film thickness between the wavelength conversion member and the resin member in a region between the plurality of light-emitting elements, and the constant film thickness is smaller than a distance between a top surface of the supporting substrate and a lower surface of the wavelength conversion member.


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