The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Mar. 11, 2021
Huawei Technologies Co., Ltd., Shenzhen, CN;
Shiqun Gu, San Diego, CA (US);
Huawei Technologies Co., Ltd., Shenzhen, CN;
Abstract
A multi-chip module includes a first Integrated Circuit (IC) die a second IC die. The first IC die includes an array of first bond pads, a plurality of first code group circuits, and first interleaved interconnections between the plurality of first code group circuits and the array of first bond pads, the first interleaved interconnections including a first interleaving pattern causing data from different code group circuits to be coupled to adjacent first bond pads. The second IC die includes a second array of bond pads that electrically couple to the array of first bond pads, a plurality of second code group circuits, and second interleaved interconnections between the plurality of second code group circuits and the array of second bond pads, the second interleaved interconnections including a second interleaving pattern causing data from different code groups to be coupled to adjacent second bond pads.