The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Dec. 16, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jihun Cheon, Suwon-si, KR;
Hyun Jung Lee, Suwon-si, KR;
Pyojin Jeon, Suwon-si, KR;
Yong-Jhin Cho, Suwon-si, KR;
Wonjun Lee, Suwon-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/67 (2006.01); B08B 7/00 (2006.01); B08B 3/02 (2006.01); B08B 7/04 (2006.01); G03F 7/30 (2006.01); B08B 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B08B 3/024 (2013.01); B08B 5/02 (2013.01); B08B 7/0057 (2013.01); B08B 7/04 (2013.01); G03F 7/30 (2013.01); B08B 2203/005 (2013.01);
Abstract
An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.