The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Jun. 29, 2021
Applicant:
Osram Oled Gmbh, Regensburg, DE;
Inventors:
Mathias Wendt, Hausen, DE;
Andreas Weimar, Regensburg, DE;
Assignee:
OSRAM OLED GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4846 (2013.01); H01L 21/76885 (2013.01); H01L 23/498 (2013.01); H01L 24/04 (2013.01); H01L 24/05 (2013.01); H01L 24/82 (2013.01); H01L 2021/60015 (2013.01); H01L 2021/6027 (2013.01); H01L 2021/60277 (2013.01);
Abstract
An electronic component includes a lead frame; a semiconductor chip arranged above the lead frame; and a connection layer sequence arranged between the lead frame and the semiconductor chip, wherein the connection layer sequence includes a first intermetallic layer including gold and indium or gold, indium and tin, a second intermetallic layer including indium and a titanium compound, indium and nickel, indium and platinum or indium and titanium, and a third intermetallic layer including indium and gold.