The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Apr. 05, 2017
Sumitomo Electric Industries, Ltd., Osaka, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Abstract
Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α/α<0.9 and relational expression (2) 0.7<α/α<0.9 holds, where αrepresents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and αrepresents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and αrepresents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and αrepresents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.