The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Oct. 15, 2018
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Taketoshi Tanaka, Kyoto, JP;

Kosei Osada, Kyoto, JP;

Masahiko Arimura, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/40 (2006.01); H01G 4/005 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01F 27/40 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01G 4/005 (2013.01); H01G 4/30 (2013.01); H01F 2027/2809 (2013.01);
Abstract

An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.


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