The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Nov. 22, 2019
Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);
University of Colorado Boulder, Boulder, CO (US);
Ercan Dede, Ann Arbor, MI (US);
Yucheng Gao, Boulder, CO (US);
Vivek Sankaranarayanan, Boulder, CO (US);
Aritra Ghosh, Boulder, CO (US);
Robert Erickson, Boulder, CO (US);
Dragan Maksimovic, Boulder, CO (US);
TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, TX (US);
UNIVERSITY OF COLORADO BOULDER, Boulder, CO (US);
Abstract
Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.