The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

May. 20, 2020
Applicant:

Beijing Institute of Technology, Beijing, CN;

Inventors:

Chunguang Xu, Beijing, CN;

Dezhi Li, Beijing, CN;

Yuren Lu, Beijing, CN;

Ruili Jia, Beijing, CN;

Peng Yin, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); B06B 3/00 (2006.01); C21D 10/00 (2006.01);
U.S. Cl.
CPC ...
C21D 10/00 (2013.01); B06B 1/0622 (2013.01); B06B 3/00 (2013.01); B06B 2201/70 (2013.01);
Abstract

The present disclosure provides a device and a method for reducing and homogenizing residual stress during machining in which a workpiece is fixed, such as milling, boring, drilling and planning, with which high-energy acoustic waves are emitted to the workpiece via a tight contact between a plurality of high-energy wave exciters on a bench and a workpiece coated with a coupling medium, and residual stress inside the machined workpiece is reduced and homogenized through elastic wave energy generated in the workpiece by the high-energy acoustic waves. In this way, the purpose of reducing and homogenizing the residual stress while machining is achieved, realizing a stress-free machining, and the deformation of the workpiece during and after machining is minimized.


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