The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Nov. 04, 2019
Applicant:
Daicel Corporation, Osaka, JP;
Inventor:
Yuichi Sakanishi, Tokyo, JP;
Assignee:
DAICEL CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 163/00 (2006.01); H01L 21/306 (2006.01); C08G 65/26 (2006.01); C09D 5/08 (2006.01); C09K 13/02 (2006.01); H01L 21/302 (2006.01); C09G 1/02 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 65/2609 (2013.01); C09D 5/08 (2013.01); C09G 1/02 (2013.01); C09K 13/02 (2013.01); H01L 21/302 (2013.01); H01L 21/30625 (2013.01); H01L 21/02013 (2013.01); H01L 21/02024 (2013.01);
Abstract
Provided is a surface protectant that suppresses corrosion of a semiconductor wafer surface by a basic compound, and reduces defects in the semiconductor wafer. The semiconductor wafer surface protectant of the present invention includes a compound represented by Formula (1) below;RO—(CHO)—H  (1)