The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Oct. 25, 2019
Mitsui Chemicals, Inc., Tokyo, JP;
Tadahiro Sunaga, Yamato, JP;
Jun Okabe, Tokyo, JP;
Shizuo Tokito, Yonezawa, JP;
Koji Yokosawa, Yonezawa, JP;
Mitsui Chemicals, Inc., Tokyo, JP;
Abstract
Provided are an expandable or bendable circuit board having good body-contact feel, strong against bending and folding, and an electronic device made therefrom. The bendable circuit board includes: a film comprising a polyurethane synthesized by reacting a long-chain polyol with polyisocyanate and having a storage modulus at 25° C. of 20 to 200 MPa, a tensile strength of 20 to 80 MPa, and an elongation at break of 500 to 900%, and the temperature of which the storage elastic modulus reaches to 1 MPa is at 155° C. or higher; and circuit wiring formed in contact with a surface of the film. Alternatively, an expandable circuit board having the ratio ρ/ρof the specific electrical resistance ρ of the circuit wiring when the circuit wiring is expanded to the specific electrical resistance (Ω·cm) ρof the circuit wiring before the circuit wiring is expanded is within a range of 1.05 to 10.0.