The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Aug. 07, 2018
Ushio Denki Kabushiki Kaisha, Tokyo, JP;
Kenichi Hirose, Tokyo, JP;
Makoto Yamanaka, Tokyo, JP;
Shinji Suzuki, Tokyo, JP;
Kenji Hatakeyama, Tokyo, JP;
Ushio Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
Provided is a microchip that can achieve a favorable bonding state in the bonding portion between first and second substrates even if the microchip is large in size. A microchip includes a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, and a channel surrounded by a bonding portion between the first substrate and the second substrate is formed by a channel forming step formed at least in the first substrate. Further, a noncontact portion is formed to surround the bonding portion, and an angle θformed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies θ>90°.