The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Aug. 12, 2020
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Silam J Choy, Corvallis, OR (US);
Michael W Cumbie, Corvallis, OR (US);
Devin Alexander Mourey, Corvallis, OR (US);
Chien-Hua Chen, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01); B41J 2/155 (2006.01); B41J 2/175 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1637 (2013.01); B41J 2/14 (2013.01); B41J 2/1433 (2013.01); B41J 2/14072 (2013.01); B41J 2/14145 (2013.01); B41J 2/155 (2013.01); B41J 2/16 (2013.01); B41J 2/1601 (2013.01); B41J 2/1603 (2013.01); B41J 2/1607 (2013.01); B41J 2/1628 (2013.01); B41J 2/17526 (2013.01); B41J 2/17553 (2013.01); B41J 2002/14362 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/19 (2013.01); B41J 2202/20 (2013.01);
Abstract
In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.