The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Sep. 27, 2019
Applicant:
Systems on Silicon Manufacturing Co. Pte. Ltd., Singapore, SG;
Inventors:
Jayakumar Pachaiyappan, Singapore, SG;
Wah Ann Tan, Singapore, SG;
Assignee:
Systems on Silicon Manufacturing Company Pte Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/32 (2012.01); B24B 37/10 (2012.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24B 37/32 (2013.01); B24B 37/105 (2013.01); B24B 37/20 (2013.01);
Abstract
A CMP tool for polishing a semiconductor wafer is disclosed. The CMP tool includes a polishing head with a wafer carrier unit on which a wafer is mounted for polishing. The wafer carrier unit includes a support plate with a seal disposed on its sidewall. The seal improves sealing of the flexible membrane to the support plate. This improves reliability by avoiding slippage during the dechucking stage as well as wafer slippage during wafer loading stage, thereby avoiding wafer damage as well as non-uniform polishing.