The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Apr. 22, 2019
Soochow University, Jiangsu, CN;
Zhixin Xia, Suzhou, CN;
Wenjuan Jiang, Suzhou, CN;
Tuo Shi, Suzhou, CN;
Lei Chen, Suzhou, CN;
Jiachao Xu, Suzhou, CN;
SOOCHOW UNIVERSITY, Jiangsu, CN;
Abstract
Provided is a FeCrCuTiV high-entropy alloy powder for laser melting deposition manufacturing and a preparation method thereof, in percent by weight, the composition of the high-entropy alloy powder is: chromium 17-20%; copper 22-25%; titanium 16-19%; vanadium 17-20%; and ferrum 19-22%, wherein by utilizing the solid solution effect of alloying elements such as Ti, V and Cu of the high-entropy alloy, it can effectively alleviate the differences in thermal expansion coefficient, melting point, elastic modulus, etc. of the tungsten/steel or tungsten/copper heterogeneous interface, can reduce the residual stress level at the heterogeneous interface during the laser melting deposition manufacturing process and avoid the precipitation of Laves phase, and can meet the manufacturing requirements of tungsten/steel and tungsten/copper heterogeneous components for fusion reactors.