The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Oct. 24, 2019
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Takuro Suyama, Ina, JP;

Takatoshi Igarashi, Tokyo, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 1/05 (2006.01); A61B 1/00 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
A61B 1/051 (2013.01); A61B 1/00018 (2013.01); A61B 1/00114 (2013.01); A61B 1/05 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 27/14618 (2013.01); H01L 2224/3224 (2013.01); H01L 2224/73204 (2013.01);
Abstract

An endoscope includes an image pickup module, and the image pickup module includes: an image pickup device an external electrode being disposed on a back surface of the image pickup device; a wiring element provided with a through-hole passing through a first main surface and a second main surface, a first electrode on the first main surface being bonded with the external electrode; a signal cable bonded with a second electrode on the second main surface of the wiring element; and a first resin that seals a first bump bonding the first electrode and the external electrode and a second bump bonding the second electrode and the signal cable, and fills the through-hole.


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