The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Feb. 04, 2021
Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

Peter Brewer, Westlake Village, CA (US);

Aurelio Lopez, Malibu, CA (US);

Pamela R. Patterson, Los Angeles, CA (US);

Assignee:

HRL LABORATORIES, LLC, Malibu, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H05K 3/34 (2006.01); B23K 3/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3431 (2013.01); B23K 1/0016 (2013.01); B23K 3/00 (2013.01); B23K 2101/42 (2018.08); H05K 2203/163 (2013.01); H05K 2203/166 (2013.01);
Abstract

A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.


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