The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Dec. 22, 2020
Applicant:
Beijing Voyager Technology Co., Ltd., Beijing, CN;
Inventors:
Yu-Ching Yeh, Mountain View, CA (US);
Yue Lu, Mountain View, CA (US);
Youmin Wang, Mountain View, CA (US);
Assignee:
Beijing Voyager Technology Co., Ltd., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/024 (2006.01); H01S 5/40 (2006.01); H01S 5/0237 (2021.01); H01S 5/02 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); H01S 5/042 (2006.01); G01S 17/931 (2020.01); G01S 7/481 (2006.01); H05K 3/42 (2006.01); H05K 3/34 (2006.01); H01S 5/02315 (2021.01); H01S 5/0232 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); H01S 5/0216 (2013.01); H01S 5/0237 (2021.01); H01S 5/02476 (2013.01); H01S 5/4025 (2013.01); G01S 7/4815 (2013.01); G01S 17/931 (2020.01); H01S 5/0232 (2021.01); H01S 5/02315 (2021.01); H01S 5/042 (2013.01); H05K 1/0206 (2013.01); H05K 3/34 (2013.01); H05K 3/423 (2013.01); H05K 7/20445 (2013.01); H05K 2201/09563 (2013.01);
Abstract
A laser package is mounted on the printed circuit board. At least one thermal via extends through the printed circuit board, coupled to the laser package. A thermal bridge is coupled to the at least one thermal via on the bottom of the printed circuit board. A thermal paste connects the thermal bridge to a conductive ground plane on the bottom of the printed circuit board, and to a mechanical housing.