The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Jun. 22, 2020
Applicant:

Tesat-spacecom Gmbh & Co. KG, Backnang, DE;

Inventors:

Christian Arnold, Backnang, DE;

Tobias Kässer, Backnang, DE;

Michael Franz, Backnang, DE;

Tobias Janocha, Backnang, DE;

Andre Berger, Backnang, DE;

Ralf Kröner, Backnang, DE;

Ulrich Mahr, Backnang, DE;

Benjamin Falk, Backnang, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/71 (2011.01); H01R 103/00 (2006.01);
U.S. Cl.
CPC ...
H01R 12/712 (2013.01); H01R 2103/00 (2013.01);
Abstract

A circuit arrangement having two interconnected high-frequency components, namely a first component and a second component, is described. A connection for transferring high-frequency signals is arranged between the first component and the second component. The connection includes at least one inner conductor, which is at least partially enclosed by an outer conductor. The inner conductor is connected to the first component and to the second component in order to transfer high-frequency signals. The second component includes a contact surface on a connecting surface and the inner conductor is pressed using a pressure force onto the contact surface, to establish a high-frequency connection between the first component and the second component.


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