The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Feb. 20, 2019
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Wei Li, Beijing, CN;

Jing Wang, Beijing, CN;

Jie Xiang, Beijing, CN;

Li Wang, Beijing, CN;

Ming Li, Beijing, CN;

Na Zhang, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 23/34 (2006.01); H01L 21/00 (2006.01); H05K 7/20 (2006.01); H05K 1/00 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 51/52 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 27/3244 (2013.01); H01L 51/529 (2013.01); H01L 27/3276 (2013.01); H01L 2251/5338 (2013.01);
Abstract

A display device and a manufacturing method thereof are provided. The display device includes a display panel, a heat dissipation layer, and a chip on film. The heat dissipation layer is on a non-display side of the display panel and includes a driving circuit arranging region and a peripheral region. The heat dissipation layer located in at least a part of the driving circuit arranging region is insulated from the heat dissipation layer located in the peripheral region. The chip on film is on a side of the heat dissipation layer away from the display panel and is in the driving circuit arranging region.


Find Patent Forward Citations

Loading…