The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Sep. 03, 2020
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventor:

Byoung Yong Kim, Seoul, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1345 (2006.01); G02F 1/1368 (2006.01); G02F 1/1362 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13452 (2013.01); G02F 1/1368 (2013.01); G02F 1/13458 (2013.01); G02F 1/136286 (2013.01);
Abstract

A display device includes a first substrate including a display area including pixels, a non-display area disposed around the display area, and a base substrate, a second substrate facing the first substrate, and a printed circuit board attached to side surfaces of the first substrate and the second substrate, wherein the first substrate includes a plurality of connection wirings connected to the pixels, arranged on the base substrate, extending along a first direction, and spaced apart from each other along a second direction intersecting the first direction, and a plurality of connection pads arranged on the side surface of the first substrate and the side surface of the second substrate, connected to the connection wirings, extending along a thickness direction, and spaced apart from each other along the second direction, the first substrate further includes a coupling member disposed between the printed circuit board and the side surface of the first substrate and between the printed circuit board and the side surface of the second substrate, and the coupling member includes a non-conductive film portion disposed to overlap the connection wirings along the first direction, and a conductive film portion disposed around the non-conductive film portion.


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