The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Oct. 24, 2020
Harbin Institute of Technology, Harbin, CN;
HARBIN INSTITUTE OF TECHNOLOGY, Harbin, CN;
Abstract
An ultrasonic phased array transducer device with a two-dimensional hinge array structure belongs to equipment in the technical field of ultrasonic detection. A connecting rod is fixedly connected to a fixed support and a two-dimensional hinge array respectively. Voice coil motors are symmetrically arranged in a shape of the British 'Union Jack' with the connecting rod as a center, and are fixedly connected to the fixed support. Force output rods are respectively connected to voice coil motor coils and the upper surfaces of array units. Piezoelectric array elements are fixedly connected to the lower surfaces of all the array units. The numbers of the voice coil motors and the force output rods are 2N (N=4, 8, 12, 16, 20), the number of the piezoelectric array elements is 2N+1, and different N values are selected according to the sizes of workpieces to be detected. In the disclosure, by adjusting the current of each voice coil motor coil, the corresponding force output rod generates displacement to drive the two-dimensional hinge array unit to generate displacement, so as to push out and retract the hinge array unit and the piezoelectric array element fixedly connected below and drive the two-dimensional hinge array to generate deformation, so that the piezoelectric array elements fully fit with the surface of the workpiece to be detected. The disclosure can be applied to detection of the workpieces to be detected with flat surfaces, curved surfaces or spherical surfaces.