The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Dec. 31, 2019
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Simon Joshua Jacobs, Lucas, TX (US);
Kathryn Anne Schuck, Dallas, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C25D 3/12 (2006.01); C25D 3/48 (2006.01); C25D 7/12 (2006.01); C23C 18/08 (2006.01); C23C 18/32 (2006.01); C23C 18/42 (2006.01); H01L 21/768 (2006.01); C23C 18/16 (2006.01); C25D 3/46 (2006.01);
U.S. Cl.
CPC ...
C25D 3/12 (2013.01); B32B 15/018 (2013.01); C23C 18/08 (2013.01); C23C 18/1637 (2013.01); C23C 18/32 (2013.01); C23C 18/42 (2013.01); C25D 3/48 (2013.01); C25D 7/12 (2013.01); H01L 21/76873 (2013.01); H01L 21/76874 (2013.01); C25D 3/46 (2013.01);
Abstract
A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.