The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Jan. 24, 2020
Applicant:

National Institute of Advanced Industrial Science and Technology, Tokyo, JP;

Inventors:

Kentaro Shinoda, Tsukuba, JP;

Takanori Saeki, Tsukuba, JP;

Masakazu Mori, Tsukuba, JP;

Jun Akedo, Tsukuba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 24/04 (2006.01); C23C 4/01 (2016.01); C23C 4/134 (2016.01); C08K 3/28 (2006.01); C08K 3/40 (2006.01); C08K 3/14 (2006.01); C08K 3/00 (2018.01); C08K 3/16 (2006.01); B32B 5/18 (2006.01); C04B 32/00 (2006.01); C08K 3/38 (2006.01); B23B 9/00 (2006.01); B32B 9/00 (2006.01); C08K 3/02 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C23C 24/04 (2013.01); B23B 9/00 (2013.01); B32B 5/18 (2013.01); B32B 9/00 (2013.01); C04B 32/005 (2013.01); C08K 3/00 (2013.01); C08K 3/14 (2013.01); C08K 3/16 (2013.01); C08K 3/28 (2013.01); C08K 3/38 (2013.01); C08K 3/40 (2013.01); C23C 4/01 (2016.01); C23C 4/134 (2016.01); C03C 2214/04 (2013.01); C08K 2003/023 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2244 (2013.01); Y10T 428/29 (2015.01); Y10T 428/31504 (2015.04);
Abstract

A problem to be solved by the present invention is that there is no method for forming a dense structure on a porous structure at low cost. In addition, another object is to provide a high quality and inexpensive structure of a brittle material and a laminate thereof as an intermediate layer for facilitating formation of a dense structure on a porous structure. A structure is provided having a brittle particle assembly having a plurality of brittle particles, wherein the brittle particle assemblies are arranged adjacently to each other, and the brittle particles having a brittle material region in the periphery are crosslinked (connected) by the brittle material region to bond the brittle particles to each other, and thereby form a brittle material crosslinked structure region preventing the mobility of the brittle particles.


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