The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Feb. 25, 2020
Applicant:
Poongsan Corporation, Pyeongtaek-Si, KR;
Inventors:
Assignee:
POONGSAN CORPORATION, Pyeongtaek-Si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22F 1/08 (2006.01); B21B 1/26 (2006.01); C22C 9/06 (2006.01);
U.S. Cl.
CPC ...
C22F 1/08 (2013.01); B21B 1/26 (2013.01); C22C 9/06 (2013.01);
Abstract
Disclosed is a method of producing a copper alloy sheet material, wherein the copper alloy sheet material contains nickel (Ni) 0.5 to 1.5% by weight; cobalt (Co) 0.3 to 1.5% by weight; silicon (Si) 0.35 to 0.8% by weight; chromium (Cr) 0.05 to 0.5% by weight; a balance amount of copper (Cu); and inevitable impurities. Further, disclosed is a copper alloy sheet material produced using the method.
Hwang, Jiin. (2022). Method of producing copper alloy sheet material with excellent strength and conductivity and copper alloy sheet material produced therefrom (U.S. Patent No. 11535920). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11535920
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile