The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Jun. 26, 2019
Applicant:

Nippon Yakin Kogyo Co., Ltd., Tokyo, JP;

Inventors:

Takayuki Watanabe, Kawasaki, JP;

Fugao Wei, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 38/54 (2006.01); C22C 38/44 (2006.01); C22C 38/42 (2006.01); C22C 38/06 (2006.01); C22C 38/04 (2006.01); C22C 38/02 (2006.01); C22C 38/00 (2006.01); C21D 9/46 (2006.01); C21D 8/02 (2006.01); C21D 6/00 (2006.01);
U.S. Cl.
CPC ...
C22C 38/54 (2013.01); C21D 6/004 (2013.01); C21D 6/005 (2013.01); C21D 6/008 (2013.01); C21D 8/0205 (2013.01); C21D 8/0226 (2013.01); C21D 8/0263 (2013.01); C21D 9/46 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/42 (2013.01); C22C 38/44 (2013.01); C21D 2211/001 (2013.01); C21D 2211/005 (2013.01);
Abstract

A duplex stainless steel has reduced precipitation risks of Al nitride and Cr nitride which are undesirable precipitates, and has superior low temperature toughness. The duplex stainless steel has in mass %, indicated as '%', C: 0.001 to 0.030%, Si: 0.05 to 0.5%, S: not more than 0.002%, Ni: 6 to 7.5%, Cr: 23 to 26%, Mo: 2 to 4.0%, N: 0.20 to 0.40%, Al: 0.005 to 0.03%, Mn: 0.05 to 0.3%, B: 0.0001 to 0.0050% and Fe, and the remainder being inevitable impurities. The duplex stainless steel has an impact value of not less than 87.5 J/cmat −46±2° C. as defined in Japanese Industrial Standards Z2242.


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